- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 35/04 - Structural details of the junction; Connections of leads
Patent holdings for IPC class H01L 35/04
Total number of patents in this class: 236
10-year publication summary
22
|
28
|
24
|
22
|
30
|
43
|
40
|
33
|
4
|
0
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
LG Innotek Co., Ltd. | 6758 |
43 |
LG Chem, Ltd. | 17205 |
6 |
Imam Abdulrahman Bin Faisal University | 343 |
6 |
Texas Instruments Incorporated | 19376 |
5 |
LT Metal Co., Ltd. | 24 |
5 |
3m Innovative Properties Company | 18406 |
4 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
4 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
4 |
GENTHERM Incorporated | 277 |
4 |
Livingcare Co.,Ltd | 12 |
4 |
Hyundai Motor Company | 19021 |
3 |
Kia Motors Corporation | 7946 |
3 |
Alphabet Energy, Inc. | 21 |
3 |
Face International Corp. | 88 |
3 |
Free Form Fibers, LLC | 38 |
3 |
Mitsubishi Materials Corporation | 2378 |
3 |
The Regents of the University of Colorado, a body corporate | 2430 |
3 |
Birmingham Technologies, Inc. | 24 |
3 |
TEGway Co., Ltd. | 40 |
3 |
BASF SE | 19740 |
2 |
Other owners | 122 |